Thanks for the post! My comments:
- 2.0 mm pitch header on top of the motherboard simply means that you can buy corresponding 2.0 mm wires and a more “standard” TPM LPC module. For instance 14 pin MSI or ASUS should work, since they both are 2.0mm pitch. In other words: It seems really unnecessary, complicated and even a bit risky to solder wires on underneath the motherboard, when you already have a fairly standard header available on top. At the bottom of this post is how I installed the TPM underneath my ZX-99EV3 using nothing but wires and electrical vinyl tape. Sits perfectly installed in a case that way, since the standoffs are a few mm taller than the TPM module.
- The official PR9-H and PR9-H 2.0 BIOS both support TPM, and that might get the fan functionality back. But a quick look with Intel FITC shows me that the official PR9 comes with an H81 chipset. So if I were you, I would absolutely try the Huananzhi BD4 BIOS instead.
- Lastly I could be completely wrong but: If the aim is to use TPM 2.0 functionality and not TPM 1.2, then I do not think you need to solder wires onto the chipset either. I know with 100% certainty that I did not need to do that with the three boards I have verified myself (X99Z V102, ZX-99EV3, X99D3M4). See my instructions/measurements. Only 9 wires were needed, PCICLK and SERIRQ was not needed.
